Semiconductor device and method of fabricating same

ABSTRACT

A semiconductor device and method of fabricating the semiconductor device are disclosed. The method includes forming a plurality of gate electrodes at a predetermined interval on a surface of a semiconductor substrate, forming spacers on sidewalls of the gate electrodes, depositing an interconnection layer conformally on the surface of the semiconductor substrate over the gate electrodes and the spacers, selectively etching the interconnection layer, wherein at least a portion of the interconnection layer that is formed on the surface of the semiconductor substrate and sidewalls of the spacers and located between adjacent gate electrodes remains after the selective etch, and forming an electrical contact on the etched interconnection layer located between the adjacent gate electrodes.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority under 35 U.S.C. §119 to Chinese PatentApplication No. 201210483778.3, filed on Nov. 23, 2012 and entitled“SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME”, which isincorporated herein by reference in its entirety.

FIELD OF THE INVENTION

The present invention relates to semiconductors, and more particularly,to a semiconductor device and method of fabricating the same.

DESCRIPTION OF THE RELATED ART

Further miniaturization of semiconductor devices and integration of ICs(Integrated Circuits) can increase performance of the semiconductordevices and ICs. However, the miniaturization of semiconductor devicesposes scaling challenges, particularly in the fabrication of thesemiconductor devices. The scaling challenges will be briefly describedwith reference to FIG. 1, which shows a cross-sectional view of a metaloxide semiconductor (MOS) device in the related art.

As shown in FIG. 1, a MOS 10 includes a semiconductor substrate 100 andgate electrodes 115 formed above a surface of the semiconductorsubstrate 100, with a gate insulating film 105 formed between each gateelectrode 115 and the semiconductor substrate 100. The MOS 10 furtherincludes spacers 110 formed on sidewalls of the gate electrodes 115, anda dielectric layer 160 formed above the gate electrodes 115. Contactholes 165 are formed in the dielectric layer 160 and filled with plug170 (for example, a tungsten plug). Additionally, a conductive layer,such as a Ti or TiN film, may be formed on the sidewalls and bottom ofthe contact holes 165 prior to filling the contact holes 165 with theplug 170. Each contact hole 165 and corresponding plug 170 (and theconductive layer, if present) collectively constitutes an electricalcontact.

As further shown in FIG. 1, the bottom surface of each contact hole 165is in contact with a surface of an interconnection layer 125. Theinterconnection layer 125, in turn, is formed on a surface of thesemiconductor substrate 100 and the gate electrodes 115.

In semiconductor device scaling, it is desirable to increase devicedensity by increasing the number of devices within a given area. Thismay be achieved, for example, by reducing the gate-to-gate distance(i.e., the distance between adjacent gate electrodes 115) or the size(width) of the electrical contact. However, as shown in FIG. 1, theelectrical contact (formed by the contact hole 165 and the plug 170) islocated between adjacent gate electrodes 115, and coupled to theinterconnection layer 125 formed on the surface of the semiconductorsubstrate 100. As a result, the size of the electrical contact has to beconsidered when designing the gate-to-gate distance of a semiconductordevice (for example, MOS 10). Otherwise, reductions in the gate-to-gatedistance without corresponding adjustments to the size of the electricalcontact may lead to electrical shorts between adjacent gate electrodes115 and/or premature device failures. In particular, the size of thegate spacers (for example, spacers 110), size of the electrical contact,and contact-to-active area design rules can limit the gate-to-gatedistance in the structure of a MOS device, thereby impacting devicescaling.

SUMMARY

The present disclosure is directed to address at least the above devicescaling challenges in the related art.

According to some embodiments of the inventive concept, a method offabricating a semiconductor device is provided. The method includesforming a plurality of gate electrodes at a predetermined interval on asurface of a semiconductor substrate, forming spacers on sidewalls ofthe gate electrodes, depositing an interconnection layer conformally onthe surface of the semiconductor substrate over the gate electrodes andthe spacers, selectively etching the interconnection layer, wherein atleast a portion of the interconnection layer that is formed on thesurface of the semiconductor substrate and sidewalls of the spacers andlocated between adjacent gate electrodes remains after the selectiveetch, and forming an electrical contact on the etched interconnectionlayer located between the adjacent gate electrodes.

According to some other embodiments of the inventive concept, a methodof fabricating a semiconductor device is provided. The method includesforming a plurality of gate electrodes at a predetermined interval on asurface of a semiconductor substrate, forming a first hard mask layer ona surface of the gate electrodes, forming spacers on sidewalls of thegate electrodes, depositing an interconnection layer conformally on thesurface of the semiconductor substrate over the first hard mask layer,the gate electrodes, and the spacers, selectively etching theinterconnection layer, wherein a portion of the interconnection layerand a portion of the hard mask layer located above adjacent gateelectrodes remain after the selective etch, and a portion of theinterconnection layer that is formed on the surface of the semiconductorsubstrate and sidewalls of the spacers and located between the adjacentgate electrodes remains after the selective etch, and forming anelectrical contact on the etched interconnection layer located betweenthe adjacent gate electrodes.

According to some embodiments of the inventive concept, a semiconductordevice is provided. The semiconductor device includes a plurality ofgate electrodes formed on a surface of a semiconductor substrate at apredetermined interval, with spacers formed on sidewalls of the gateelectrodes, an interconnection layer deposited conformally on thesurface of the semiconductor substrate over the gate electrodes and thespacers and located between adjacent gate electrodes, and an electricalcontact formed on the interconnection layer.

According to some other embodiments of the inventive concept, asemiconductor device is provided. The semiconductor device includes aplurality of gate electrodes formed on a surface of a semiconductorsubstrate at a predetermined interval, with spacers formed on sidewallsof the gate electrodes, an interconnection layer deposited conformallyon the surface of the semiconductor substrate over the gate electrodesand the spacers and located between adjacent gate electrodes, aninsulating layer formed between the interconnection layer and a surfaceof the gate electrodes, and an electrical contact formed on theinterconnection layer.

In some embodiments, the first hard mask layer may be used as an etchstop layer during the selective etching of the interconnection layer.

In some embodiments, the first hard mask layer may be formed of anitride, an oxide, or an oxynitride.

In some embodiments, a second hard mask layer may be formed on theinterconnection layer, wherein the second hard mask layer is completelyremoved after the selective etching of the interconnection layer.

In some embodiments, the second hard mask layer may be formed of anitride, an oxide, or an oxynitride.

In some embodiments, the interconnection layer may be formed of a metalor polysilicon.

In some embodiments, the interconnection layer may have a thickness ofabout 300˜400 Å.

In some embodiments, the semiconductor device may be a metal oxidesemiconductor (MOS) transistor.

BRIEF DESCRIPTION OF THE DRAWINGS

The following detailed description of some embodiments of the inventiveconcept will be more clearly understood when read in conjunction withthe appended drawings. It should be understood, however, that theembodiments are not limited to the arrangements and instrumentalities asshown. In the drawings, like numerals are used to indicate like elementsthroughout. Furthermore, other desirable features and characteristicswill become apparent from the subsequent detailed description and theappended claims, in view of the accompanying drawings and the foregoingtechnical field and background.

For simplicity and clarity of illustration, the drawings illustrate thegeneral manner of construction, and descriptions and details ofwell-known features and techniques may be omitted to avoid unnecessarilyobscuring aspects of the illustrated embodiments. Additionally, theelements in the drawings may not be drawn to scale.

FIG. 1 is a cross-section view of a metal oxide semiconductor (MOS)device in the related art.

FIGS. 2-6 are cross-section views of a semiconductor device at variousstages of fabrication according to an embodiment of the inventiveconcept.

FIG. 7 is a cross-section view of a semiconductor device according toanother embodiment of the inventive concept.

FIG. 8 is a flowchart of a method of fabricating a semiconductor deviceaccording to an embodiment of the inventive concept.

FIG. 9 is a flowchart of a method of fabricating a semiconductor deviceaccording to another embodiment of the inventive concept.

DESCRIPTION OF THE EMBODIMENTS

The detailed description set forth below with reference to the appendeddrawings is intended to be a description of some embodiments of theinventive concept. It is to be understood that the same or equivalentfunctions may be accomplished by different embodiments.

The terms “first”, “second”, and other such terms in the description andthe claims, if present, are used to distinguish between similarelements. The terms do not necessarily prescribe a particular sequenceor chronological order. It is to be understood that the terms as usedare interchangeable under appropriate circumstances such that theembodiments described herein can be used in sequences other than thoseillustrated or otherwise described. Furthermore, the terms “comprise,”“include,” “have” and any variations thereof, are intended to covernon-exclusive inclusions, such that a process, method, article, orapparatus that comprises, includes, or has a list of elements is notnecessarily limited to those elements, but may include other elementsnot expressly listed or inherent to such process, method, article, orapparatus.

Below, a semiconductor device and method of fabricating thesemiconductor device according to an embodiment of the inventive conceptwill be described with reference to FIGS. 2-6.

Referring to FIG. 2, a semiconductor substrate 100 (for example, asilicon substrate) is provided. Gate electrodes 115 may be formed on asurface of the semiconductor substrate 100 using known depositiontechniques such as Chemical Vapor Deposition (CVD). An insulating film105 may be formed between the gate electrodes 115 and the semiconductorsubstrate 100. The insulating film 105 may be formed of, for example,silicon oxide, silicon nitride, or silicon oxynitride.

As shown in FIG. 2, a first hard mask layer 120 is formed on a surfaceof the gate electrodes 115, and spacers 110 are formed on the sidewallsof the gate electrodes 115. The first hard mask layer 120 may be formedof, for example, a nitride, an oxide, or an oxynitride. In someembodiments, the first hard mask layer 120 is formed of siliconoxynitride.

In some embodiments, the first hard mask layer 120 may be used as anetch stop layer.

In some other embodiments, the first hard mask layer 120 may be omitted.However, omission of the first hard mask layer 120 may lead to stricterprocess requirements (for example, in terms of alignment/etch accuracy).

Next, as shown in FIG. 3, an interconnection layer 130 is depositedconformally on the semiconductor substrate 100 over the first hard masklayer 120, gate electrodes 115, and spacers 110. The interconnectionlayer 130 may be formed of a conductive material, for example, a metalor a semiconductor material. In some embodiments, the interconnectionlayer 130 is formed of polysilicon. In order to deposit a continuousconformal film, the interconnection layer 130 should be thin, preferablyhaving a thickness of about 300˜400 Å.

Referring to FIG. 3, a second hard mask layer 140 is depositedconformally on the interconnection layer 130. The second hard mask layer140 may be formed of, for example, a nitride, an oxide, or anoxynitride. In some embodiments, the second hard mask layer 140 isformed of silicon oxynitride.

With reference to FIGS. 4 and 5, the interconnection layer 130 isselectively etched such that a portion of the interconnection layer 130and a portion of the first hard mask layer 120 located above adjacentgate electrodes 115 remain after the selective etch. In addition, aportion of the interconnection layer 130 that is formed on the surfaceof the semiconductor substrate 100 and the sidewalls of the spacers 110and located between adjacent gate electrodes 115, also remains after theselective etch.

With reference to FIG. 4, a layer of photoresist is first coated overthe semiconductor substrate 100 and photolithography (denoted by thearrows in FIG. 4) is then performed. FIG. 4 shows a residual photoresist150 remaining after the photolithography.

Next, referring to FIG. 5, the interconnection layer 130 is selectivelyetched using the residual photoresist 150 as an etch mask. Theinterconnection layer 130 may be selectively etched, for example, usingdry etching or wet etching. As shown in FIG. 5, the selective etchingresults in the complete removal of the second hard mask layer 140, whilea portion of the interconnection layer 130 and a portion of the firsthard mask 120 located above adjacent gate electrodes 115 remain afterthe selective etch. As previously described, a portion of theinterconnection layer 130 that is formed on the surface of thesemiconductor substrate 100 and the sidewalls of the spacers 110 andlocated between adjacent gate electrodes 115, also remains after theselective etch.

Referring to FIG. 5, the portion of the interconnection layer 130 andthe portion of the first hard mask layer 120 remaining after theselective etch are denoted as 130′ and 120′, respectively. In someembodiments, the etched first hard mask layer 120′ can provide aninsulating function to prevent electrical shorts between the gateelectrodes 115 and the etched interconnection layer 130′.

In some embodiments, the interconnection layer 130 may be selectivelyetched to completely remove the first hard mask layer 120 and the secondhard mask layer 140, while at least a portion of the interconnectionlayer 130 that is formed on the surface of the semiconductor substrate100 and the sidewalls of the spacers 110 and located between adjacentgate electrodes 115, remains after the selective etch. (see, e.g., FIG.7)

Next, with reference to FIG. 6, a dielectric layer 160 is formed overthe structure of FIG. 5. The dielectric layer 160 may be formed of, forexample, tetraethoxysilane (TEOS).

As shown in FIG. 6, contact holes 165 are formed in the dielectric layer160 and filled with plug 170 (for example, a tungsten plug). In someembodiments, a conductive layer such as a Ti or TiN film may be formedon the sidewalls and bottom of the contact holes 165. Each contact hole165 and corresponding plug 170 (and the conductive layer, if present)collectively forms an electrical contact providing electrical continuityto the etched interconnection layer 130′. The resulting structure ofFIG. 6 constitutes a semiconductor device 20 (e.g., a MOS device)according to an embodiment of the inventive concept.

Referring to FIG. 6, the semiconductor device 20 includes the gateelectrodes 115 formed on the semiconductor substrate 100 at apredetermined interval, with the spacers 110 formed on the sidewalls ofthe gate electrodes 115. The semiconductor device 20 also includes aportion of the etched interconnection layer 130′ and a portion of theetched first hard mask layer 120′ located above adjacent gate electrodes115, as well as a portion of the etched interconnection layer 130′ thatis formed on the surface of the semiconductor substrate 100 and thesidewalls of the spacers 110 and located between adjacent gateelectrodes 115. The semiconductor device 20 further includes anelectrical contact (formed by the contact hole 165 and plug 170) formedon a portion of the etched interconnection layer 130′ located betweenadjacent gate electrodes 115.

As shown in FIG. 6, the portion of the etched interconnection layer 130′formed on the semiconductor substrate 100 between adjacent gateelectrodes 115 is in contact with the bottom surface of the electricalcontact, and the portion of the etched interconnection layer 130′ formedon the sidewalls of the spacers 110 is in contact with the lower sidesurfaces of the electrical contact. As a result, the semiconductordevice 20 of FIG. 6 can provide more contact area between the electricalcontact and the (etched) interconnection layer compared to aconventional semiconductor device (for example, the MOS device of FIG.1). The increase in contact area allows the gate-to-gate distance of thesemiconductor device 20 to be reduced without impacting current carryingcapability. In contrast, a reduction in the gate-to-gate distance of aconventional semiconductor device may require a corresponding decreasein contact area (when the distance between adjacent edges of the spacersis less than the width of the electrical contact), which maysubsequently result in lower current carrying capability. Thus, thesemiconductor device 20 allows the predetermined interval of adjacentgate electrodes 115 to be less than that of a conventional semiconductordevice (for example, the MOS device of FIG. 1) without impacting currentcarrying capability. Therefore, the semiconductor device 20 can enablegreater scaling compared to conventional semiconductor devices.

According to another embodiment of the inventive concept, the portion ofthe etched interconnection layer 130′ and the portion of the etchedfirst hard mask layer 120′ located above adjacent gate electrodes 115may be completely removed by a selective etch to form the semiconductordevice 20′ shown in FIG. 7. As shown in FIG. 7, a portion of the etchedinterconnection layer 130′ that is formed near the top edges of thespacers 110 is also removed after the selective etch.

Referring to FIG. 7, the semiconductor device 20′ includes the gateelectrodes 115 formed on a semiconductor substrate 100 at apredetermined interval, with the spacers 110 formed on the sidewalls ofthe gate electrodes 115. The semiconductor device 20′ also includes anetched interconnection layer 130′ formed on the surface of thesemiconductor substrate 100 and a portion of the sidewalls of thespacers 110 and located between adjacent gate electrodes 115. Thesemiconductor device 20′ further includes an electrical contact (formedby the contact hole 165 and plug 170) formed on a portion of the etchedinterconnection layer 130′ located between adjacent gate electrodes 115.

Similar to the semiconductor device 20 of FIG. 6, the semiconductordevice 20′ of FIG. 7 can provide more contact area between theelectrical contact and the (etched) interconnection layer compared tothe conventional MOS device of FIG. 1. Therefore, the semiconductordevice 20′ of FIG. 7 also provides scaling advantages similar to thosepreviously described with reference to the semiconductor device 20 ofFIG. 6.

One of ordinary skill in the art may recognize that the semiconductordevice 20 of FIG. 6 provides a larger contact area between theelectrical contact and the (etched) interconnection layer compared tothe semiconductor device 20′ of FIG. 7. As a result, wider processmargins (e.g., lower alignment/etch accuracy) may be allowed in thefabrication of the semiconductor device 20, whereas stricter processmargins (e.g., higher alignment/etch accuracy) may be required in thefabrication of the semiconductor device 20′.

Those skilled in the art would further appreciate that the semiconductordevice 20 (or 20′) may include a well region, a shallow trench isolation(STI), a source/drain region, and/or other semiconductor elements formedin the semiconductor substrate 100.

In some embodiments, the spacers 110 (and optionally, a portion of thetop surface of the gate electrodes 115) may serve as a source/drainregion to reduce the area of the device structure. The source/drainregion may be further connected to the electrical contact through theetched interconnection layer 130′.

In some embodiments, a salicide layer may be formed on the top of theetched interconnection layer 130′ and the gate electrodes 115 using asalicide process, the salicide layer for reducing contact resistance.

In some embodiments, the semiconductor device 20 (or 20′) may be furtherprovided with a protective cap layer (such as a SiN layer) on the gateelectrodes 115 and the etched interconnection layer 130′.

FIG. 8 is a flowchart of a method of fabricating a semiconductor deviceaccording to an embodiment of the inventive concept. In someembodiments, the method 50 in FIG. 8 may be used to fabricate thesemiconductor device 20′ of FIG. 7.

Referring to step S100 of FIG. 8, a plurality of gate electrodes (e.g.,gate electrodes 115) are formed on a surface of a semiconductorsubstrate (e.g., semiconductor substrate 100) at a predeterminedinterval.

At step S102, spacers (e.g., spacers 110) are formed on the sidewalls ofthe gate electrodes.

At step S104, an interconnection layer (e.g., interconnection layer 130)is deposited conformally on the semiconductor substrate over the gateelectrodes and the spacers.

At step S106, the interconnection layer is selectively etched such thatat least a portion of the interconnection layer that is formed on thesurface of the semiconductor substrate and the sidewalls of the spacersand located between adjacent gate electrodes, remains after theselective etch.

At step S108, an electrical contact (e.g., formed by a contact hole 165and a plug 170) is formed on a portion of the etched interconnectionlayer located between adjacent gate electrodes.

With reference to the method 50 of FIG. 8, a portion of the etchedinterconnection layer formed on the semiconductor substrate betweenadjacent gate electrodes may be in contact with a bottom surface of theelectrical contact, and a portion of the etched interconnection layerformed on the sidewalls of the spacers may be in contact with the lowerside surfaces of the electrical contact. (See, e.g., semiconductordevice 20′ of FIG. 7). As a result, a semiconductor device formed usingthe method 50 may provide more contact area between the electricalcontact and the (etched) interconnection layer, compared to aconventional semiconductor device (for example, the MOS device of FIG.1). For reasons similar to those described with reference to FIGS. 6 and7, the predetermined interval of adjacent gate electrodes of asemiconductor device formed using the method 50 can be less than that ofan equivalent conventional semiconductor device, without impactingcurrent carrying capability. Depending on the type of semiconductordevices, fabrication processes, and other factors, the predeterminedinterval of adjacent gate electrodes (of a semiconductor device formedusing the method 50) may be reduced to different extents, therebyenabling further scaling of semiconductor devices.

In some embodiments of the method 50, a portion of the interconnectionlayer extending to the top of the gate electrodes remains after theselective etch S106, so as to provide a larger contact area between theelectrical contact and the (etched) interconnection layer. The largercontact area may allow for wider process margins (e.g., loweralignment/etch accuracy) in the fabrication of the semiconductor device.

FIG. 9 is a flowchart of a method of fabricating a semiconductor deviceaccording to another embodiment of the inventive concept. In someembodiments, the method 60 in FIG. 9 may be used to fabricate thesemiconductor device 20 of FIG. 6.

Referring to step S100 of FIG. 9, a plurality of gate electrodes (e.g.,gate electrodes 115) are formed on a surface of a semiconductorsubstrate (e.g., semiconductor substrate 100) at a predeterminedinterval.

At step S101, a first hard mask layer (e.g., first hard mask layer 120)is formed on a surface of the gate electrodes.

At step S102, spacers (e.g., spacers 110) are formed on the sidewalls ofthe gate electrodes.

At step S103, an interconnection layer (e.g., interconnection layer 130)is deposited conformally on the semiconductor substrate over the firsthard mask layer, gate electrodes, and spacers.

At step S105, the interconnection layer is selectively etched such thata portion of the interconnection layer and a portion of the first hardmask layer located above adjacent gate electrodes remain after theselective etch. In addition, a portion of the interconnection layer thatis formed on the surface of the semiconductor substrate and thesidewalls of the spacers and located between adjacent gate electrodes,remains after the selective etch.

At step S108, an electrical contact (e.g., formed by a contact hole 165and a plug 170) is formed on a portion of the etched interconnectionlayer located between adjacent gate electrodes.

In some embodiments of the method 60, a portion of the interconnectionlayer extending to the top of the gate electrodes remains after theselective etch S105, so as to provide a larger contact area between theelectrical contact and the (etched) interconnection layer. The largercontact area may allow for wider process margins (e.g., loweralignment/etch accuracy) in the fabrication of the semiconductor device.

Similar to the method 50 of FIG. 8, the predetermined interval ofadjacent gate electrodes of a semiconductor device formed using themethod 60 of FIG. 9 can be less than that of a conventionalsemiconductor device, without impacting current carrying capability.Depending on the type of semiconductor devices, fabrication processes,and other factors, the predetermined interval of adjacent gateelectrodes (of a semiconductor device formed using the method 60) may bereduced to different extents, thereby enabling further scaling ofsemiconductor devices.

As previously described, the method 60 in FIG. 9 may be used tofabricate the semiconductor device 20 of FIG. 6 in some embodiments, andthe method 50 in FIG. 8 may be used to fabricate the semiconductordevice 20′ of FIG. 7 in some other embodiments. With reference to thesemiconductor device 20 of FIG. 6 and the semiconductor device 20′ ofFIG. 7, one of ordinary skill in the art will appreciate that the method60 may result in a larger contact area between the electrical contactand the (etched) interconnection layer compared to the method 50. As aresult, wider process margins (e.g., lower alignment/etch accuracy) maybe allowed in the method 60, whereas stricter process margins (e.g.,higher alignment/etch accuracy) may be required in the method 50.

Examples of semiconductor devices and methods of fabricating thesemiconductor devices according to different embodiments of theinventive concept have been described in detail in the foregoingdescription. Details well-known to those of ordinary skill in the arthave not been described so as to avoid obscuring the inventive concept.Nevertheless, those skilled in the art would understand how to implementthe disclosed technical solutions based on the above detaileddescription.

Although embodiments of the inventive concept have been described indetail, those skilled in the art would understand that the disclosedembodiments are only intended to be illustrative without limiting thescope of the present disclosure, and that the above embodiments can bemodified without departing from the scope and spirit of the presentdisclosure.

What is claimed is:
 1. A method of fabricating a semiconductor device,comprising: forming a plurality of gate electrodes at a predeterminedinterval on a surface of a semiconductor substrate; forming spacers onsidewalls of the gate electrodes; depositing an interconnection layerconformally on the surface of the semiconductor substrate over the gateelectrodes and the spacers; selectively etching the interconnectionlayer, wherein at least a portion of the interconnection layer that isformed on the surface of the semiconductor substrate and sidewalls ofthe spacers and located between adjacent gate electrodes, remains afterthe selective etch, and wherein a portion of the gate electrodes isexposed to form an exposed portion of the gate electrodes after theselective etch of the interconnection layer; forming a dielectric layeron the semiconductor substrate, the sidewalls of the spacers, and theexposed portion of the gate electrodes; and forming an electricalcontact on the etched interconnection layer located between the adjacentgate electrodes, wherein the electrical contact is selectively formed ona portion of the etched interconnection layer located between adjacentlaterally opposite spacers.
 2. The method according to claim 1, furthercomprising: forming a first hard mask layer on a surface of the gateelectrodes, wherein the first hard mask layer is used as an etch stoplayer during the selective etching of the interconnection layer.
 3. Themethod according to claim 2, wherein the first hard mask layer is formedof a nitride, an oxide, or an oxynitride.
 4. The method according toclaim 1, further comprising: forming a second hard mask layer on theinterconnection layer, wherein the second hard mask layer is completelyremoved after the selective etching of the interconnection layer.
 5. Themethod according to claim 4, wherein the second hard mask layer isformed of a nitride, an oxide, or an oxynitride.
 6. The method accordingto claim 1, wherein selective etching the interconnection layer furthercomprises: applying a layer of photoresist over the semiconductorsubstrate, performing a photolithographic process on the layer ofphotoresist to form a residual photoresist, and selectively etching theinterconnection layer using the residual photoresist as an etch mask. 7.The method according to claim 1, wherein the interconnection layer isformed of a metal or polysilicon.
 8. The method according to claim 1,wherein the interconnection layer has a thickness of about 300˜400 Å. 9.A method of fabricating a semiconductor device, comprising: forming aplurality of gate electrodes at a predetermined interval on a surface ofa semiconductor substrate; forming a first hard mask layer on a surfaceof the gate electrodes; forming spacers on sidewalls of the gateelectrodes; depositing an interconnection layer conformally on thesurface of the semiconductor substrate over the first hard mask layer,the gate electrodes, and the spacers; selectively etching theinterconnection layer, wherein a portion of the interconnection layerand a portion of the hard mask layer located above adjacent gateelectrodes remain after the selective etch, and a portion of theinterconnection layer that is formed on the surface of the semiconductorsubstrate and sidewalls of the spacers and located between the adjacentgate electrodes remains after the selective etch, and wherein a portionof the gate electrodes is exposed to form an exposed portion of the gateelectrodes after the selective etch of the interconnection layer;forming a dielectric layer on the semiconductor substrate, the sidewallsof the spacers, and the exposed portion of the gate electrodes; andforming an electrical contact on the etched interconnection layerlocated between the adjacent gate electrodes, wherein the electricalcontact is selectively formed on a portion of the etched interconnectionlayer located between adjacent laterally opposite spacers.
 10. Themethod according to claim 9, wherein the selective etching furthercomprises: applying a layer of photoresist over the semiconductorsubstrate, performing a photolithographic process on the layer ofphotoresist to form a residual photoresist, and selectively etching theinterconnection layer using the residual photoresist as an etch mask.11. The method according to claim 9, wherein the interconnection layeris formed of a metal or polysilicon.
 12. The method according to claim11, wherein the interconnection layer has a thickness of about 300˜400Å.